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@Article{14404,
    author = "Piotr Witkowski",
    title  = "The Use of IR Soldering Stations in the Process of Disassembling in BGA Packaging",
    year   = "2020",
    journal = "Pomiary Automatyka Robotyka",
    month   = "2",
    doi     = "10.14313/PAR_236/59",
    volume  = "24",
    number  = "236",
    pages  = "59-62",
    keywords = "circuit disassembly, FCBGA, IR soldering station, printed circuit board, reflow soldering",
    url  = "https://www.par.pl/Archiwum/2020/2-2020/The-Use-of-IR-Soldering-Stations-in-the-Process-of-Disassembling-in-BGA-Packaging"
    }