TY  - JOUR 
AU  - Witkowski, Piotr 
TI  - The Use of IR Soldering Stations in the Process of Disassembling in BGA Packaging 
JO  - Pomiary Automatyka Robotyka 
PY  - 2020 
KW  - circuit disassembly 
KW  - FCBGA 
KW  - IR soldering station 
KW  - printed circuit board 
KW  - reflow soldering 
DO  - 10.14313/PAR_236/59 
VL  - 24  
IS  - 236 
SP  - 59 
EP  - 62 
UR  - https://www.par.pl/Archiwum/2020/2-2020/The-Use-of-IR-Soldering-Stations-in-the-Process-of-Disassembling-in-BGA-Packaging 
M3  - http://dx.doi.org/10.14313/PAR_236/59 
ER  -